Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P
Closed
The source does not publish a status. We worked this out from the opening and closing dates it does publish.
1 Stück -Die-to-Wafer Bonder (IPMS-MRS14.1) Option 1 (LV Pos. 1.13): Please offer an extended warranty of further 12 months (in total 24 month) Option 2 (LV Pos. 3.6): The tool should handle wafers with the size of (source and target) Option 3 (LV Pos. 3.14): The chiplets can be picked from this type of tray (source) Option 4 (LV Pos. 4.1): The system can be controlled using SECS-GEM commands. The following protocols must be supported: E30, E5, E37 and E10. Alternatively, a proprietary but completely documented communication interface has to be provided.
- Status
- Closed
- Deadline
- Published
- Country
- Germany
- Funder
- Fraunhofer-Gesellschaft, Einkauf B12
- Official page
- Open at the source portal
What applying involved
2 steps, all of them taken from this call's own documents.
This call is closed. The steps below show what applying involved, and are kept for reference only.
Understand the call
- Read the call on the source portal and download its documents
Submit
- Submit before the closing date shown above
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Where this came from
- Source document
- https://oeffentlichevergabe.de/api/notice-exports?pubMonth=2026-07
- Document fingerprint
1e212f621354509b(SHA-256, first 16 hex characters)- Collected
- First recorded here
What has changed
- url first recorded as https://vergabe.fraunhofer.de/NetServer/TenderingProcedureDetails?function=_Details&TenderOID=54321-Tender-19ed072d12c-5e5a6f905b726809 on
- deadline first recorded as 2026-07-24 on
- published_on first recorded as 2026-07-16 on
- status_basis first recorded as derived_window on
- status first recorded as closed on
- title first recorded as Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P on
Data source
Source: Datenservice Öffentlicher Einkauf (Bundesministerium für Wirtschaft und Klimaschutz). CC0 1.0 (CC-ZERO) — no conditions.
We collected this from the source on .
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