AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Country
- Austria
- Type
- Beneficiary
- Grants received
- 15
Funding record
- 15 grants on record
- €7,145,282.78 awarded in total
- 2008–2023 span of the record
Grants recorded here are the ones our sources publish, and the total is the sum of those. It is not a statement of this organisation's total funding.
Programmes
5 further grants are on record without a programme named by the source, or under a programme outside the largest shown here.
Frequent partners
Organisations this one has been funded alongside on two or more projects. A single shared consortium is not counted: the largest here has 195 members, and being on one list together is not a collaboration.
- FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV
- INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
- INFINEON TECHNOLOGIES AG
- ROBERT BOSCH GMBH
- MATERIALS CENTER LEOBEN FORSCHUNG GMBH
- NXP SEMICONDUCTORS NETHERLANDS BV
- POLITECNICO DI MILANO
- TECHNISCHE UNIVERSITAET CHEMNITZ
Calls from this organisation
No published calls from this organisation.
Grants received
- European ECOsystem for greeN Electronics
- BOOSTER PACKAGING FOR EUROPE
- Heterogeneous Integration for Connectivity and Sustainability
- MIcroelectronics RELiability driven by Artificial Intelligence
- Packaging of novel Ultra-dyNamiC pHotonic switches and transceivers for integration into 5G radio access network and datacenter sub-systems
- D-band radio 5G network technology
- Challenging environments tolerant Smart systems for IoT and AI
- Intelligent Reliability 4.0
- Research for GaN technologies, devices, packages and applications to address the challenges of the future GaN roadmap
- GaN densily integrated with Si-CMOS for reliable, cost effective high frequency power delivery systems
- Ressource recovery from industrial waste water by cutting edge membrane technologies
- Power Semiconductor and Electronics Manufacturing 4.0
- Sustainable Smart Mobile Devices Lifecycles through Advanced Re-design, Reliability, and Re-use and Remanufacturing Technologies
- Unique Smart anti-tampering and Enveloping TecHnologies
- High density integration by embedding chips for reduced size modules and electronic systems
Data source
© European Union, 2026. Source: CORDIS. Reused under Commission Decision 2011/833/EU — CC BY 4.0.
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