NXP Semiconductors France
- Country
- France
- Type
- Beneficiary
- Website
- www.nxp.com
- Grants received
- 21
Funding record
- 21 grants on record
- €8,995,821.58 awarded in total
- 2009–2025 years covered
This total adds up only the grants our sources publish. It is not the total funding this organisation has received.
Programmes
- Horizon Europe Framework Programme
- ENIAC
- Seventh Framework Programme
- Horizon 2020 Framework Programme
- ARTEMIS
8 further grants are on record without a programme named by the source, or under a programme outside the largest shown here.
Frequent partners
Organisations funded alongside this one on two or more projects. Sharing a single project does not count. Some projects have as many as 195 participants, and appearing on the same list once is not a working relationship.
- TECHNISCHE UNIVERSITEIT EINDHOVEN
- FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV
- NXP SEMICONDUCTORS NETHERLANDS BV
- POLITECNICO DI TORINO
- INSTITUTO SUPERIOR DE ENGENHARIA DO PORTO
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- STMICROELECTRONICS SRL
- ALMA MATER STUDIORUM - UNIVERSITA DI BOLOGNA
Calls from this organisation
No published calls from this organisation.
Grants received
- Shift2SDV - a common Software development framework and hardware independent microservice-oriented middleware architecture for the stepwise migration to the Software Defined Vehicle of the Future
- RISC-V GENERATION OF HIGH PERFORMANCE AUTOMOTIVE PROCESSORS AND COMPUTING PLATFORMS
- Hardware Abstraction Layer for a European Software Defined Vehicle approach
- OPEVA - OPtimization of Electric Vehicle Autonomy
- Heterogeneous Integration for Connectivity and Sustainability
- Together for RISc-V Technology and ApplicatioNs
- LIghtweight Battery System for Extended Range at Improved SafeTY
- LIghtweight Battery System for Extended Range at Improved SafeTY
- Cell-integrated SENSIing functionalities for smart BATtery systems with improved performance and safety
- Verification and Validation of Automated Systems' Safety and Security
- Delivering the 3b generation of LNMO cells for the xEV market of 2025 and beyond
- (Ultra)Sound Interfaces and Low Energy iNtegrated SEnsors
- European Packaging, Assembly and Test Pilot for Manufacturing of Advanced System-in-Package
- Noisy Electromagnetic Fields - A Technological Platform for Chip-to-Chip Communication in the 21st Century
- Arrowhead
Data source
© European Union, 2026. Source: CORDIS. Reused under Commission Decision 2011/833/EU — CC BY 4.0.
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