International collaboration EU and Japan on semiconductors
Open
Status as published by the data source.
Expected Outcome:
Projects are expected to contribute to the following expected outcomes:
• Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities.
• Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem
Expected outcomes should have direct and immediate impact on European industry.
Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications, and networking events.
- Status
- Open
- Deadline
- (time not stated)
- Opens
- Published
- Total budget
- €5,000,000
- Grant range
- €3,000,000 – €5,000,000
- Country
- European Union (EU-wide)
- Programme
- Digital Europe Programme (DIGITAL)
- Official page
- Open at the source portal
Other calls under Digital Europe Programme (DIGITAL)
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All calls under this programme
Similar opportunities
- Call with Digital Partnership and TTC countries
- AI compute evaluation and deployment platform for EU infrastructure
- International cooperation in AI (IA)
- Key electronic components
- Skills Hubs of Excellence
- Platforms and end-products
Where this came from
- Source document
- https://ec.europa.eu/info/funding-tenders/opportunities/data/topicDetails/digital-ju-chips-2026-sg-japan.json
- Document fingerprint
e942a2053fb1947e(SHA-256, first 16 hex characters)- Retrieved
- First recorded here
What has changed
- url first recorded as https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportunities/topic-details/digital-ju-chips-2026-sg-japan on
- currency first recorded as EUR on
- amount_max first recorded as 5000000.00 on
- amount_min first recorded as 3000000.00 on
- budget_total first recorded as 5000000.00 on
- deadline first recorded as 2026-09-24 on
- opens_on first recorded as 2026-07-07 on
- published_on first recorded as 2026-07-07 on
- status_basis first recorded as source_status on
- status first recorded as open on
- title first recorded as International collaboration EU and Japan on semiconductors on
Data source
© European Union, 2026. Source: EU Funding & Tenders Portal. Reused under Commission Decision 2011/833/EU — CC BY 4.0.
Retrieved from the source on .
The source last updated this document on Mon, 06 Jul 2026 22:01:42 GMT.
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