International collaboration EU and Japan on semiconductors

Open

This is the status published by the official source.

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Expected Outcome:
Projects are expected to contribute to the following expected outcomes:

• Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities.

• Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem
Expected outcomes should have direct and immediate impact on European industry.
Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications, and networking events.

Status

Open

Deadline

8 December 2026 (time not stated)

Opens

7 July 2026

Published

7 July 2026

Total budget

€5,000,000

Grant range

€3,000,000 – €5,000,000

Country

European Union (EU-wide)

Programme

Digital Europe Programme (DIGITAL)

Funder

European Commission

Official page

Open at the source portal

What applying involves

11 steps, all of them taken from this call's own documents.

Understand the call

• Read the call on the source portal and download its documents
• Write the proposal against the award criteria and thresholds

  described Appendix 8 of Work Programme - Chips for Europe Initiative — conditions §5b

• Check the grant's legal and financial set-up standard for this programme

  described Appendix 8 of Work Programme - Chips for Europe Initiative . Call Details Call document and annexes: Model Grant Agreements (MGA) DEP MGA Additional documents: DEP Regulation 2021/964 EU Financial Regulation 2024/2509 EU Grants AGA — Annotated Model Grant Agreement Funding & Tenders Portal Online Manual Funding & Tenders Portal Terms and Conditions Funding & Tenders Portal Privacy Statement — conditions §6

• Check the amount you plan to request against the call's range

Check you are eligible

• Confirm your technology readiness level against the range the call states
• Check every partner is established in an eligible country standard for this programme

  described in Appendix 8 of Work Programme - Chips for Europe Initiative — conditions §2

• Meet the call's other eligibility conditions

  Appendix 8 of Work Programme - Chips for Europe Initiative — conditions §3

• Be able to show financial and operational capacity

  described Appendix 8 of Work Programme - Chips for Europe Initiative — conditions §4

Prepare the documents

• Prepare Part B of the Application Form standard for this programme

  Proposal page limits and layout: described in Part B of the Application Form available in the Submission System. — conditions

Submit

• Check the submission and evaluation process

  described Appendix 8 of Work Programme - Chips for Europe Initiative and the Online Manual — conditions §5a

• Submit before the closing date shown above

  The source states the closing day but no closing time — check the portal before the last day. — calls.deadline

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