Call with Digital Partnership and TTC countries
Open
Status as published by the data source.
Expected Outcome:
The focus needs to be on areas where Digital Partnership countries bring strong complementary expertise, including advanced packaging, heterogeneous integration, and photonic chip technologies. The topic would aim to foster collaboration between European and Digital Partnership countries’ R&I communities. Projects are expected to contribute to the following outcomes:
• Innovative design and integration concepts for neuromorphic computing systems supporting very low energy consumption, connectivity, embedded functions for mobile applications.
• Alternative manufacturing process technologies for semiconductor chips including frontend or backend for heterogenous integration. The technologies should sustain in the mid- and long-term the fast-paced evolution of device performance, miniaturisation and cost, while reducing the environmental footprint.
• Very advanced packaging solutions aiming heterogeneous integration of multiple functions and materials for applications in communication (RF, mmW or THz), sensing, actuating, power management and active/passive integration.
- Status
- Open
- Deadline
- (time not stated)
- Opens
- Published
- Total budget
- €5,000,000
- Grant range
- €1,000,000 – €5,000,000
- Country
- European Union (EU-wide)
- Programme
- Horizon Europe (HORIZON)
- Official page
- Open at the source portal
Other calls under Horizon Europe (HORIZON)
- PV based electrification of the economy: Designing & optimising PV systems supporting industrial electrification and promoting participation in electricity markets (EUPI-PV Partnership)
- Advanced TSO control rooms to enhance grid observability, stability and resilience
- Advanced Distribution Management Systems (ADSM) for more efficient and flexible distribution grids
- Community of practice - Data-Driven Decision-Making in Energy
- Industrial processes and equipment for innovative, reliable and scalable tandem technologies (EUPI-PV Partnership)
- Integrated Approaches for Retrofitting Infrastructures with Innovative Energy Storage Technologies
- Demonstration of hydropower technologies for efficient and forward-looking refurbishment of existing hydropower plants
- Delivery of industrial CCUS clusters – Societal Readiness pilot
All calls under this programme
Similar opportunities
- International collaboration EU and Japan on semiconductors
- IA Resilience call reinforcing Europe's strength in photonics
- Photonics Innovation Factory for Europe (Photonics Partnership) (IA)
- Digital solutions for defining synergies in international renewable energy value chains
- Startup Europe
- Piloting emerging Smart IoT Platforms and decentralized intelligence (IA)
Where this came from
- Source document
- https://ec.europa.eu/info/funding-tenders/opportunities/data/topicDetails/horizon-ju-chips-2026-3-ria.json
- Document fingerprint
6a56503e02b5222f(SHA-256, first 16 hex characters)- Retrieved
- First recorded here
What has changed
- url first recorded as https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportunities/topic-details/horizon-ju-chips-2026-3-ria on
- currency first recorded as EUR on
- amount_max first recorded as 5000000.00 on
- amount_min first recorded as 1000000.00 on
- budget_total first recorded as 5000000.00 on
- deadline first recorded as 2026-09-16 on
- opens_on first recorded as 2026-07-07 on
- published_on first recorded as 2026-07-07 on
- status_basis first recorded as source_status on
- status first recorded as open on
- title first recorded as Call with Digital Partnership and TTC countries on
Data source
© European Union, 2026. Source: EU Funding & Tenders Portal. Reused under Commission Decision 2011/833/EU — CC BY 4.0.
Retrieved from the source on .
The source last updated this document on Mon, 06 Jul 2026 22:01:27 GMT.
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