Call with Digital Partnership and TTC countries
Closed
The source does not publish a status. We worked this out from the opening and closing dates it does publish.
Expected Outcome:
The focus needs to be on areas where Digital Partnership countries bring strong complementary expertise, including advanced packaging, heterogeneous integration, and photonic chip technologies. The topic would aim to foster collaboration between European and Digital Partnership countries’ R&I communities. Projects are expected to contribute to the following outcomes:
• Innovative design and integration concepts for neuromorphic computing systems supporting very low energy consumption, connectivity, embedded functions for mobile applications.
• Alternative manufacturing process technologies for semiconductor chips including frontend or backend for heterogenous integration. The technologies should sustain in the mid- and long-term the fast-paced evolution of device performance, miniaturisation and cost, while reducing the environmental footprint.
• Very advanced packaging solutions aiming heterogeneous integration of multiple functions and materials for applications in communication (RF, mmW or THz), sensing, actuating, power management and active/passive integration.
- Status
- Closed
- Deadline
- (time not stated)
- Opens
- Published
- Total budget
- €5,000,000
- Grant range
- €1,000,000 – €5,000,000
- Country
- European Union (EU-wide)
- Programme
- Horizon Europe (HORIZON)
- Funder
- European Commission
- Official page
- Open at the source portal
What applying involved
11 steps, all of them taken from this call's own documents.
This call is closed. The steps below show what applying involved, and are kept for reference only.
Understand the call
- Read the call on the source portal and download its documents
-
Write the proposal against the award criteria and thresholds
standard for this programme
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 — conditions §5a
-
Check the grant's legal and financial set-up
standard for this programme
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 and in the Annex G of the Work Programme General Annexes. Specific conditions described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 Call Details Application and evaluation forms and model grant agreement (MGA): Application form templates Please use the application form that you will find in the Submission System. You can find … — conditions §6
- Check the amount you plan to request against the call's range
Check you are eligible
-
Check every partner is established in an eligible country
standard for this programme
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 . A number of non-EU/non-Associated Countries that are not automatically eligible for funding have made specific provisions for making funding available for their participants in Horizon Europe projects. See the information in the Horizon Europe Programme Guide — conditions §2
-
Meet the call's other eligibility conditions
standard for this programme
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 — conditions §3
-
Be able to show financial and operational capacity
standard for this programme
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 — conditions §4
- Check the conditions for financial support to third parties
Prepare the documents
-
Prepare Part B of the Application Form
standard for this programme
Proposal page limits and layout: described in Part B of the Application Form available in the Submission System. — conditions
Submit
-
Check the submission and evaluation process
standard for this programme
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 — conditions §5b
-
Submit before the closing date shown above
The source states the closing day but no closing time — check the portal before the last day. — calls.deadline
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All calls under this programme
Similar opportunities
- International collaboration EU and Japan on semiconductors
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- Startup Europe
- Piloting emerging Smart IoT Platforms and decentralized intelligence (IA)
Where this came from
- Source document
- https://ec.europa.eu/info/funding-tenders/opportunities/data/topicDetails/horizon-ju-chips-2026-3-ria.json
- Document fingerprint
6a56503e02b5222f(SHA-256, first 16 hex characters)- Collected
- First recorded here
What has changed
- url first recorded as https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportunities/topic-details/horizon-ju-chips-2026-3-ria on
- currency first recorded as EUR on
- amount_max first recorded as 5000000.00 on
- amount_min first recorded as 1000000.00 on
- budget_total first recorded as 5000000.00 on
- deadline first recorded as 2026-09-16 on
- opens_on first recorded as 2026-07-07 on
- published_on first recorded as 2026-07-07 on
- status_basis first recorded as source_status on
- status first recorded as open on
- title first recorded as Call with Digital Partnership and TTC countries on
Data source
© European Union, 2026. Source: EU Funding & Tenders Portal. Reused under Commission Decision 2011/833/EU — CC BY 4.0.
We collected this from the source on .
The source last changed this record on Mon, 06 Jul 2026 22:01:27 GMT.
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