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IA Resilience call reinforcing Europe's strength in photonics

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Expected Outcome:
Proposals submitted to this call are expected to address several of the following elements:
• Scaling of wafer-level photonic processes for key materials (e.g. SiN, InP, GaAs),including process integration, yield optimisation, and manufacturability at highvolumes.
• Development of packaging and test solutions that are scalable, automated, andcompatible with co-packaged optics and advanced photonic-electronic integration.
• Integration of heterogeneous materials and components, such as on-chip lasers,modulators, and detectors, using advanced packaging and assembly approaches.
• Design-process-equipment co-optimisation, enabling repeatable, cost-effectiveproduction of complex photonic circuits and systems, including use of PDKs andvalidated building blocks.
• Demonstration of system-level functionality through application-relevant use casesin strategic sectors (e.g. AI, sensing, telecommunication, mobility, health, defence),with quantified performance metrics and clear market relevance.

Status
Open
Deadline
(time not stated)
Opens
Published
Total budget
€20,000,000
Grant range
€1,000,000 – €10,000,000
Country
European Union (EU-wide)
Programme
Horizon Europe (HORIZON)
Official page
Open at the source portal

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Source document
https://ec.europa.eu/info/funding-tenders/opportunities/data/topicDetails/horizon-ju-chips-2026-ft2-ia.json
Document fingerprint
39b3588befe28e32 (SHA-256, first 16 hex characters)
Retrieved
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Data source

© European Union, 2026. Source: EU Funding & Tenders Portal. Reused under Commission Decision 2011/833/EU — CC BY 4.0.

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The source last updated this document on Mon, 06 Jul 2026 22:01:31 GMT.

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