IA Resilience call reinforcing Europe's strength in photonics
Closed
The source does not publish a status. We worked this out from the opening and closing dates it does publish.
Expected Outcome:
Proposals submitted to this call are expected to address several of the following elements:
• Scaling of wafer-level photonic processes for key materials (e.g. SiN, InP, GaAs),including process integration, yield optimisation, and manufacturability at highvolumes.
• Development of packaging and test solutions that are scalable, automated, andcompatible with co-packaged optics and advanced photonic-electronic integration.
• Integration of heterogeneous materials and components, such as on-chip lasers,modulators, and detectors, using advanced packaging and assembly approaches.
• Design-process-equipment co-optimisation, enabling repeatable, cost-effectiveproduction of complex photonic circuits and systems, including use of PDKs andvalidated building blocks.
• Demonstration of system-level functionality through application-relevant use casesin strategic sectors (e.g. AI, sensing, telecommunication, mobility, health, defence),with quantified performance metrics and clear market relevance.
- Status
- Closed
- Deadline
- (time not stated)
- Opens
- Published
- Total budget
- €20,000,000
- Grant range
- €1,000,000 – €10,000,000
- Country
- European Union (EU-wide)
- Programme
- Horizon Europe (HORIZON)
- Funder
- European Commission
- Official page
- Open at the source portal
What applying involved
11 steps, all of them taken from this call's own documents.
This call is closed. The steps below show what applying involved, and are kept for reference only.
Understand the call
- Read the call on the source portal and download its documents
- Write the proposal against the award criteria and thresholds standard for this programme
-
Check the grant's legal and financial set-up
standard for this programme
Specific conditions Please visit the Chips JU website's Call page Please refer to the calls documents section on the Chips JU website's Call page to view and download all required documents and templates. Specific Call Documents 2026 Guide for Applicants RIA_IA_FT-FPP Evaluation Form Chips IA RIA FT-FPP Template Application form Part B IA-RIA-FT FPP Ownership Control Declaration form template National Budgets Table template (xls) General Call Documents Chips JU Multiannual … — conditions §6
- Check the amount you plan to request against the call's range
Check you are eligible
- Check every partner is established in an eligible country standard for this programme
- Meet the call's other eligibility conditions standard for this programme
- Be able to show financial and operational capacity standard for this programme
- Check the conditions for financial support to third parties
Prepare the documents
- Prepare Part B of the Application Form standard for this programme
Submit
- Check the submission and evaluation process standard for this programme
-
Submit before the closing date shown above
The source states the closing day but no closing time — check the portal before the last day. — calls.deadline
Other calls under Horizon Europe (HORIZON)
- PV based electrification of the economy: Designing & optimising PV systems supporting industrial electrification and promoting participation in electricity markets (EUPI-PV Partnership)
- Advanced TSO control rooms to enhance grid observability, stability and resilience
- Advanced Distribution Management Systems (ADSM) for more efficient and flexible distribution grids
- Community of practice - Data-Driven Decision-Making in Energy
- Industrial processes and equipment for innovative, reliable and scalable tandem technologies (EUPI-PV Partnership)
- Integrated Approaches for Retrofitting Infrastructures with Innovative Energy Storage Technologies
- Demonstration of hydropower technologies for efficient and forward-looking refurbishment of existing hydropower plants
- Delivery of industrial CCUS clusters – Societal Readiness pilot
All calls under this programme
Similar opportunities
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- Call with Digital Partnership and TTC countries
- IA Resilience call reinforcing Europe's strenght in health
- International collaboration EU and Japan on semiconductors
- RIA Resilience call reinforcing Europe's strength in 6G radio communication systems
Where this came from
- Source document
- https://ec.europa.eu/info/funding-tenders/opportunities/data/topicDetails/horizon-ju-chips-2026-ft2-ia.json
- Document fingerprint
39b3588befe28e32(SHA-256, first 16 hex characters)- Collected
- First recorded here
What has changed
- url first recorded as https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportunities/topic-details/horizon-ju-chips-2026-ft2-ia on
- currency first recorded as EUR on
- amount_max first recorded as 10000000.00 on
- amount_min first recorded as 1000000.00 on
- budget_total first recorded as 20000000.00 on
- deadline first recorded as 2026-09-16 on
- opens_on first recorded as 2026-07-07 on
- published_on first recorded as 2026-07-07 on
- status_basis first recorded as source_status on
- status first recorded as open on
- title first recorded as IA Resilience call reinforcing Europe's strength in photonics on
Data source
© European Union, 2026. Source: EU Funding & Tenders Portal. Reused under Commission Decision 2011/833/EU — CC BY 4.0.
We collected this from the source on .
The source last changed this record on Mon, 06 Jul 2026 22:01:31 GMT.
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