Automated 300 mm Die-to-Wafer thermocompression bonding tool - PR1275392-3460-W
Open
The source does not publish a status. We worked this out from the opening and closing dates it does publish.
Automated 300 mm Die-to-Wafer thermocompression bonding tool
- Status
- Open
- Deadline
- Published
- Country
- Germany
- Funder
- Fraunhofer-Gesellschaft, Einkauf B12
- Official page
- Open at the source portal
What applying involves
2 steps, all of them taken from this call's own documents.
Understand the call
- Read the call on the source portal and download its documents
Submit
- Submit before the closing date shown above
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Where this came from
- Source document
- https://oeffentlichevergabe.de/api/notice-exports?pubMonth=2026-11
- Document fingerprint
d89927f2bf76ddab(SHA-256, first 16 hex characters)- Collected
- First recorded here
What has changed
- url first recorded as https://vergabe.fraunhofer.de/NetServer/TenderingProcedureDetails?function=_Details&TenderOID=54321-Tender-1a18cebaee5-64bd02a53c976dd2 on
- deadline first recorded as 2026-12-02 on
- published_on first recorded as 2026-10-30 on
- status_basis first recorded as derived_window on
- status first recorded as open on
- title first recorded as Automated 300 mm Die-to-Wafer thermocompression bonding tool - PR1275392-3460-W on
Data source
Source: Datenservice Öffentlicher Einkauf (Bundesministerium für Wirtschaft und Klimaschutz). CC0 1.0 (CC-ZERO) — no conditions.
We collected this from the source on .
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