Waferprober / Frameprober - PR1252431-2270-W
Open
Not published as a status — worked out here from the application dates.
This specification describes the requirements for a wafer prober system to be used for post-silicon verification, characterization and functional test of integrated circuits and chiplets at Fraunhofer EMFT. The wafer prober system must be able to handle 200mm and 300mm wafers and in addition wafers mounted on a dicing frame (frame prober function). This allows a very flexible usage for different analysis and test situations. The wafer prober will be coupled with an automated test system (ATE).
- Status
- Open
- Deadline
- Published
- Country
- Germany
- Official page
- Open at the source portal
What applying involves
2 steps, every one of them taken from what this call's own documents state.
Understand the call
- Read the call on the source portal and download its documents
Submit
- Submit before the closing date shown above
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Where this came from
- Source document
- https://oeffentlichevergabe.de/api/notice-exports?pubMonth=2026-08
- Document fingerprint
b37acc89829a0774(SHA-256, first 16 hex characters)- Retrieved
- First recorded here
What has changed
- url first recorded as https://vergabe.fraunhofer.de/NetServer/TenderingProcedureDetails?function=_Details&TenderOID=54321-Tender-19fd756d1d0-7c9e55a15d49637e on
- deadline first recorded as 2026-09-07 on
- published_on first recorded as 2026-08-07 on
- status_basis first recorded as derived_window on
- status first recorded as open on
- title first recorded as Waferprober / Frameprober - PR1252431-2270-W on
Data source
Source: Datenservice Öffentlicher Einkauf (Bundesministerium für Wirtschaft und Klimaschutz). CC0 1.0 (CC-ZERO) — no conditions.
Retrieved from the source on .
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