System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P
Closed
The source does not publish a status. We worked this out from the opening and closing dates it does publish.
1 Stück System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) Die Spezifikation beschreibt die Anforderungen an ein vollautomatisches Prozessgerät, das für Plasmaätzprozesse auf Wafern mit einem Durchmesser von 300 mm eingesetzt werden soll. Die Systeme werden für die Bearbeitung von Silizium-CMOS-Wafern in einer Produktionsumgebung der Reinraumklasse 1000 (entspricht in etwa Klasse 6 nach EN ISO 14644-1) eingesetzt. Das neue Werkzeug soll zur Strukturierung von Strukturen mit hohem Aspektverhältnis in Silizium sowie in allen damit verbundenen erforderlichen Materialien (z. B. SiO₂, SiN) eingesetzt werden, um dieses Hauptziel zu erreichen. Optionale Positionen gemäß Technical Tender Specification.
- Status
- Closed
- Deadline
- Published
- Country
- Germany
- Funder
- Fraunhofer-Gesellschaft, Einkauf B12
- Official page
- Open at the source portal
What applying involved
2 steps, all of them taken from this call's own documents.
This call is closed. The steps below show what applying involved, and are kept for reference only.
Understand the call
- Read the call on the source portal and download its documents
Submit
- Submit before the closing date shown above
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Where this came from
- Source document
- https://oeffentlichevergabe.de/api/notice-exports?pubMonth=2026-07
- Document fingerprint
1e212f621354509b(SHA-256, first 16 hex characters)- Collected
- First recorded here
What has changed
- url first recorded as https://vergabe.fraunhofer.de/NetServer/TenderingProcedureDetails?function=_Details&TenderOID=54321-Tender-19dd324472b-6ce21f095f09894c on
- deadline first recorded as 2026-07-15 on
- published_on first recorded as 2026-07-16 on
- status_basis first recorded as derived_window on
- status first recorded as closed on
- title first recorded as System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P on
Data source
Source: Datenservice Öffentlicher Einkauf (Bundesministerium für Wirtschaft und Klimaschutz). CC0 1.0 (CC-ZERO) — no conditions.
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