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Semi-finished product · Electronic components

Printed circuit board assembly

One kilogram of assembled printed circuit board

This page shows what the product is made of and where each figure comes from. It shows no death toll. The toll is computed from this bill of materials from session 19, and published only once it has an uncertainty interval and has passed a backtest.

A printed circuit board by mass, as sixteen studies average it: 34.7% metals — copper 21.4%, iron 3.3%, tin 3.1%, aluminium 3.0%, lead 1.9%, nickel 1.0%, zinc 0.7%, silver 0.13%, palladium 0.05%, gold 0.04%, tantalum 0.01% — and 65.3% glass fibre, epoxy resin and other non-metals. Boards differ by product and age; the source's standard deviations are as large as some of the means.

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What it is made of

Each line is one component of one kilogram of assembled printed circuit board: how much of it goes in, how much had to be produced for that, and where the figure comes from.

What it is made of
Component Quantity Source
Copper
ingredient
214 g Mori de Oliveira, Bellopede, Tori et al. (2022), Gravity and Electrostatic Separation for… · medium
Cu 21.44 wt% (sd 9.14)
Tin
ingredient
31.4 g Mori de Oliveira, Bellopede, Tori et al. (2022), Gravity and Electrostatic Separation for… · medium
Sn 3.14 wt%; solder
Steel
ingredient
32.8 g Mori de Oliveira, Bellopede, Tori et al. (2022), Gravity and Electrostatic Separation for… · low
Fe 3.28 wt%, carried as steel
Aluminium
ingredient
30.2 g Mori de Oliveira, Bellopede, Tori et al. (2022), Gravity and Electrostatic Separation for… · medium
Al 3.02 wt%
Nickel
ingredient
10.3 g Mori de Oliveira, Bellopede, Tori et al. (2022), Gravity and Electrostatic Separation for… · medium
Ni 1.03 wt%
Zinc
ingredient
7.30 g Mori de Oliveira, Bellopede, Tori et al. (2022), Gravity and Electrostatic Separation for… · medium
Zn 0.73 wt%
Silver
ingredient
1.30 g Mori de Oliveira, Bellopede, Tori et al. (2022), Gravity and Electrostatic Separation for… · medium
Ag 0.13 wt%
Gold
ingredient
0.400 g Mori de Oliveira, Bellopede, Tori et al. (2022), Gravity and Electrostatic Separation for… · medium
Au 0.04 wt%
Tantalum
ingredient
0.100 g Mori de Oliveira, Bellopede, Tori et al. (2022), Gravity and Electrostatic Separation for… · medium
Ta 0.01 wt%
Lead
ingredient
18.6 g Mori de Oliveira, Bellopede, Tori et al. (2022), Gravity and Electrostatic Separation for… · medium
Pb 1.86 wt%
Palladium
ingredient
0.500 g Mori de Oliveira, Bellopede, Tori et al. (2022), Gravity and Electrostatic Separation for… · medium
Pd 0.05 wt%
Non-metallic fraction — glass fibre, epoxy resin and other
ingredient
653 g Mori de Oliveira, Bellopede, Tori et al. (2022), Gravity and Electrostatic Separation for… · medium
100% − 34.73% metals

Down to raw materials

The whole chain multiplied out — everything one kilogram of assembled printed circuit board needs, through every intermediate product, with every loss on the way included.

Down to raw materials
Input Per functional unit
Bauxite 121 g
Coal and lignite 19.4 g
Copper 214 g
Gold 0.400 g
Iron ore 37.2 g
Nickel 10.3 g
Silver 1.30 g
Tantalum 0.100 g
Tin 31.4 g
Zinc 7.30 g
Electricity, electric arc furnace route (not in the register) 0.0226 MJ
Lead (not in the register) 18.6 g
Limestone (not in the register) 7.07 g
Non-metallic fraction — glass fibre, epoxy resin and other (not in the register) 653 g
Palladium (not in the register) 0.500 g
Recycled steel (scrap) (not in the register) 9.86 g

An input marked “not in the register” is counted by mass and reaches no supply chain yet. Industries appear as the euros or tonne-kilometres the bill of materials gives them.

How much of it is explicit

100% of this product’s mass is explicit in its own bill of materials.

Its whole chain draws on 1.13 kg of materials, losses included. 39% of that is registered raw materials — the part the model can trace harm to — 61% is inputs not yet in the register, and 0% is a declared remainder.

In the input–output model it belongs to “Manufacture of computer, electronic and optical products” (FIGARO industry C26).

In the input–output model it belongs to “Manufacture of computer, electronic and optical products” (FIGARO industry C26).

What uses it

Products whose own bill of materials includes this one.

The number this page does not show

The harm in this chain is not shown.

The model allocates the harm counted where each raw material is produced to the products that use it. That number is a count of people with a run behind it and no uncertainty interval yet, and nothing of that kind is published before the backtest of session 21. What this page can show without it is the structure: what the product is made of, and where each part of that knowledge comes from.

Sources

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